實體
三建技術課程
2025/11/04(二),13:00-17:00
線上
一、面板級先進封裝試製平台
(1).先進封裝趨勢
(2).扇出型封裝介紹
(3).面板級封裝的應用
(4).面板級先進封裝試製平台
二、Integrating Glass Solutions in Advanced Packaging (Leading the Change in Market-Focused Semiconductor Platforms)
三、Scaling the Square: Enabling Endless Heterogeneous Integration, from Cost-Driven to Cutting Edge
四、SSAIL 選擇性線路活化技術應用於半導體封裝
(1).Laser machines for industrial applications
(2).SSAIL for PCB, FPC
(3).SSAIL for semiconductor packaging