FOPLP 與 CoPoS構築未來晶片整合架構的異質整合研討會（線上） | 三建產業資訊

一、面板級先進封裝試製平台
(1).先進封裝趨勢
(2).扇出型封裝介紹
(3).面板級封裝的應用
(4).面板級先進封裝試製平台

二、Integrating Glass Solutions in Advanced Packaging (Leading the Change in Market-Focused Semiconductor Platforms)

三、Scaling the Square: Enabling Endless Heterogeneous Integration, from Cost-Driven to Cutting Edge

四、SSAIL 選擇性線路活化技術應用於半導體封裝
(1).Laser machines for industrial applications
(2).SSAIL for PCB, FPC
(3).SSAIL for semiconductor packaging

一、王泰瑞／工研院電光所經理
二、高橋 理基／Deputy General Manager, Advanced Semiconductor Packaging Group, AGC Inc.
三、蘇 泳樺／Sr. Director & the Head of Global Business Development, Panel product line, Lam Research
四、蔡銘川／茂太科技 董事